What are the effects of thermal cycling on resin’s adhesion to other materials?

Thermal cycling, the repeated exposure of materials to alternating high and low temperatures, significantly impacts resin adhesion to other materials. The primary effects include:

1. Reduced Bonding Strength: Repeated expansion and contraction from thermal cycling can weaken interfacial bonds, leading to delamination or micro-cracks.

2. Thermal Stress Accumulation: Mismatched coefficients of thermal expansion (CTE) between resin and substrates generate stress, degrading adhesion over time.

3. Polymer Degradation: Prolonged cycling may cause resin embrittlement or chemical changes, further reducing adhesion performance.

4. Moisture and Oxidation: Temperature fluctuations can accelerate environmental degradation, especially in humid or corrosive conditions.

To mitigate these effects, material selection (e.g., matching CTE), surface treatments, and flexible adhesives are often employed. Understanding these mechanisms is crucial for applications in aerospace, electronics, and automotive industries where thermal cycling is frequent.